{"created":"2023-05-15T12:35:35.188694+00:00","id":508,"links":{},"metadata":{"_buckets":{"deposit":"2a31e6ae-d67a-4455-b836-2e48f0668fe1"},"_deposit":{"created_by":2,"id":"508","owners":[2],"pid":{"revision_id":0,"type":"depid","value":"508"},"status":"published"},"_oai":{"id":"oai:kutarr.kochi-tech.ac.jp:00000508","sets":["6"]},"author_link":["1738"],"item_4_alternative_title_20":{"attribute_name":"その他のタイトル","attribute_value_mlt":[{"subitem_alternative_title":"Development of High Removal Rate and High Planarization CMP Technologies for Next-Generation Device Wafers and Wires"}]},"item_4_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2010-03","bibliographicIssueDateType":"Issued"},"bibliographic_titles":[{}]}]},"item_4_description_5":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"高知工科大学博士(工学) 平成22年3月19日授与 (甲第179号)","subitem_description_type":"Other"}]},"item_4_description_6":{"attribute_name":"引用","attribute_value_mlt":[{"subitem_description":"高知工科大学, 博士論文.","subitem_description_type":"Other"}]},"item_4_dissertation_number_66":{"attribute_name":"学位授与番号","attribute_value_mlt":[{"subitem_dissertationnumber":"26402甲第179号"}]},"item_4_publisher_34":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"高知工科大学"}]},"item_4_text_37":{"attribute_name":"アドバイザー","attribute_value_mlt":[{"subitem_text_value":"平尾,孝"}]},"item_4_version_type_17":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_ab4af688f83e57aa","subitem_version_type":"AM"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"新田, 浩士"}],"nameIdentifiers":[{"nameIdentifier":"1738","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2019-02-13"}],"displaytype":"detail","filename":"1116003891.pdf","filesize":[{"value":"3.5 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"1116003891.pdf","url":"https://kutarr.kochi-tech.ac.jp/record/508/files/1116003891.pdf"},"version_id":"eb96ab9b-1093-4968-acfd-f3cc50f81e1e"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"thesis","resourceuri":"http://purl.org/coar/resource_type/c_46ec"}]},"item_title":"次世代デバイス基板及び配線の高速、高精度CMP技術の研究開発","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"次世代デバイス基板及び配線の高速、高精度CMP技術の研究開発"}]},"item_type_id":"4","owner":"2","path":["6"],"pubdate":{"attribute_name":"公開日","attribute_value":"2012-09-03"},"publish_date":"2012-09-03","publish_status":"0","recid":"508","relation_version_is_last":true,"title":["次世代デバイス基板及び配線の高速、高精度CMP技術の研究開発"],"weko_creator_id":"2","weko_shared_id":-1},"updated":"2023-05-15T13:33:02.221234+00:00"}